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Equipment

Magnetron Sputtering Chambers

DC/RF with reactive sputtering capabilities used for thin-film coatings with single, co-sputtering and multi-source capabilities of metals and compounds

  

Kurt J. Lesker NANO36 3-source magnetron sputtering chamber for DC deposition of metals

Hysitron Triboindenter

• Heating/cooling stage -50°C to 210°C

• Dynamic testing (nanoDMA)

• Load and displacement control software

• SPM

Stylus Profilometer (Ambios)

Autodesk Ember 3D Printer

Digital light processing technology, minimum layer thickness: 10 um, Build volume (XYZ): 64mm x 40mm x 134mm

Electrochemical Dealloying Equipment

Agilent Cary 60 UV-Vis Spectrophotometer

• Measures in the 190-1100 nm wavelength range

• 1.5 nm fixed spectral bandwidth, full spectrum Xenon pulse lamp

• Equipped with a solid sample holder

Polishing, grinding and cutting equipment

Furnaces: air, argon, and vacuum environments

Microtensile Tester