Magnetron Sputtering Chambers
DC/RF with reactive sputtering capabilities used for thin-film coatings with single, co-sputtering and multi-source capabilities of metals and compounds
Kurt J. Lesker NANO36 3-source magnetron sputtering chamber for DC deposition of metals
Hysitron Triboindenter
• Heating/cooling stage -50°C to 210°C
• Dynamic testing (nanoDMA)
• Load and displacement control software
• SPM
Stylus Profilometer (Ambios)
Autodesk Ember 3D Printer
Digital light processing technology, minimum layer thickness: 10 um, Build volume (XYZ): 64mm x 40mm x 134mm
Electrochemical Dealloying Equipment
Agilent Cary 60 UV-Vis Spectrophotometer
• Measures in the 190-1100 nm wavelength range
• 1.5 nm fixed spectral bandwidth, full spectrum Xenon pulse lamp
• Equipped with a solid sample holder
Polishing, grinding and cutting equipment
Furnaces: air, argon, and vacuum environments
Microtensile Tester
